Solder paste

The company's solder paste is well soldered, with high impedance, strong wetting, and minimal residue.

Solder paste

 

Weld well

High impedance

Moisturizing strength

Less residue

 

MasterCard solder paste products fully comply with halogen-free industry standards, while also achieving the same solubility as halogenated products, making them environmentally friendly solder paste products; Even halogen-free PERHEAT still has the durability required for high temperature and long duration, which can correspond to AIR REFLOW



Lead free solder paste products

 

model

ALLOY COMPOSITION

Tin powder particle size

Solubility

Printing Time

Impedance value

Viscosity

Soldering paste content

9308

Sn96.5/Ag3/Cu0.5

25-45um

217-220

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

9305

Sn96.5/Ag3.5

25-45um

221-224

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

9358

Sn42/Bi58

25-45um

138-141

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

9037

Sn99/Ag0.3/Cu0.7

25-45um

220-225

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

6351

Sn64/Bi35/Ag1

25-45um

172-175

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

9105

Sn98.5/Ag13/Cu0.5

25-45um

219-222

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

3005

Sn69.5/Bi30/Cu0.5

25-45um

149-186

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

8175

Sn82.5/Bi17/Cu0.5

25-45um

180-209

48hts

>1 X 1012Ω

210±5pa.s

11.5%-9.5%

 

 


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