Solder paste
The company's solder paste is well soldered, with high impedance, strong wetting, and minimal residue.
Solder paste
Weld well
High impedance
Moisturizing strength
Less residue
MasterCard solder paste products fully comply with halogen-free industry standards, while also achieving the same solubility as halogenated products, making them environmentally friendly solder paste products; Even halogen-free PERHEAT still has the durability required for high temperature and long duration, which can correspond to AIR REFLOW
Lead free solder paste products
model | ALLOY COMPOSITION | Tin powder particle size | Solubility | Printing Time | Impedance value | Viscosity | Soldering paste content |
9308 | Sn96.5/Ag3/Cu0.5 | 25-45um | 217℃-220℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5% |
9305 | Sn96.5/Ag3.5 | 25-45um | 221℃-224℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5% |
9358 | Sn42/Bi58 | 25-45um | 138℃-141℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5% |
9037 | Sn99/Ag0.3/Cu0.7 | 25-45um | 220℃-225℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5% |
6351 | Sn64/Bi35/Ag1 | 25-45um | 172℃-175℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5% |
9105 | Sn98.5/Ag13/Cu0.5 | 25-45um | 219℃-222℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5% |
3005 | Sn69.5/Bi30/Cu0.5 | 25-45um | 149℃-186℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5% |
8175 | Sn82.5/Bi17/Cu0.5 | 25-45um | 180℃-209℃ | 48hts | >1 X 1012Ω | 210±5pa.s | 11.5%-9.5%
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