solder bar
The company's tin bars have high purity, less tin slag, and good fluidity.
solder bar
High-purity
less tin dross
Low liquidity
Used for wave soldering and hot dip soldering, with a working temperature of 220 ℃ -260 ℃ and the following advantages:
1. Excellent wettability, reducing the occurrence of defective solder joints;
2. Harmful impurities are extremely rare, which can improve diffusion power and enhance fluidity;
3. The solder joint is relatively bright, the liquid level is bright, there is less tin slag, the quality is consistent, and the soldering effect is stable.
Supply Form and Characteristics of MasterCard Lead-free Solder Alloy Types
number | Alloy composition (Wt%) | Melting point (℃) | Characteristics of lead-free solder | ||
tensile strength 100mm/min | Expansion rate （%） | Wettability (in the atmosphere) | |||
WSD 300A | Sn-3Ag | 221-230 | 4.7kgf/mm2 | 33 | good |
WSD 350A | Sn-3.5Ag | 221 | 4.7kgf/mm2 | 33 | good |
WSD 400A | Sn-4Ag | 221-235 | 4.7kgf/mm2 | 33 | good |
WSD 107C | Sn-0.7Cu | 227 | 3.3kgf/mm2 | ━ | good |
WSD 110C | Sn-1Cu | 227-240 | 3.3kgf/mm2 | ━ | good |
WSD 130C | Sn-3Cu | 227-320 | 3.3kgf/mm2 | ━ | good |
WSD SS | Sn-5Cu | 230-240 | 4.7kgf/mm2 | 38 | good |
WSD SB | Sn-58Bi | 138 | 7.6kgf/mm2 | 33 | good |
WSD SL | Sn-50In | 117-125 | ━ | ━ | |
WSD 208 | Sn-XAg-XCu | 210-230 | 5.3kgf/mm2 | 27 | good |
WSD 308 | Sn-XAg-XCu | 217-220 | 5.3kgf/mm2 | 27 | good |
WSD 408 | Sn-4Ag-0.5Cu | 217-223 | 5.3kgf/mm2 | 27 | good |
WSD SZB | Sn-Zn-Bi | 189-199 | ━ | ━ | ━ |
WSD 350B | Sn-Ag-Bi | 206-213 | ━ | ━ | good |
WSD 200 | Sn-Ag-Bi | 207-212 | ━ | ━ | good |
WSD 208S | Sn-XAg-XCu-Sb | 200-230 | ━ | ━ | good |
WSD 308B | Sn-XAg-XCu-Bi | 200-230 | 5.1kgf/mm2 | 25 | good |
